• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Electronic card (1) comprising an assembly of a printed circuit (2) comprising a first face (4) receiving at least one electronic component, and a heat sink (3), the printed circuit (2) and the heat sink (3) being stacked in a stacking direction (z), said heat sink (3) being attached to the printed circuit on a second face (6) opposite to the first face (4), said heat sink (3) comprising a sole (8), having the shape of a plate, and reliefs (7) protruding from a flat surface (8a) of said sole (8), the reliefs (7) being intended to increase the contact surface between the heat sink (3) and a flow of air relative to the contact surface between the sole (8) and the air flow, the sole (8) being interposed between the printed circuit (2) and the reliefs (7). ) in the stacking direction (z), the heat sink (3) being fixed directly to the printed circuit (2) by co Only and in that said heat sink (3) is in one piece.
    公开号:FR3036918A1
    申请号:FR1501114
    申请日:2015-05-29
    公开日:2016-12-02
    发明作者:Eric Predon；Pierre Belec
    申请人:Thales SA；
    IPC主号:
    专利说明:

    [0001] The invention relates to the cooling of electronic cards 5 plugged into a box or basket, also called drawer or rack. The invention finds particular utility for electronic equipment, in particular power boards, whose components heat up significantly and which require a rapid evacuation of heat. The invention is particularly interesting for on-board electronic equipment, especially cooled by ventilated air. There are, for example, computers comprising several electronic cards arranged parallel to each other in the cabinet. To ensure the maintenance of the equipment, the different cards are removable. The mounting and dismounting of the cards is done by translating them into grooves or slides of the box. The term printed circuit is a bare printed circuit, that is to say without electronic components and without heat dissipating device, and an electronic card, a printed circuit equipped with a heat sink and one or more electronic components. A printed circuit comprises an assembly of a plurality of conductive layers separated in pairs from a layer of insulating material. The layers are etched to obtain a set of conductive tracks. In operation, the components of the electronic board can dissipate a large amount of heat. This heat must be removed in order to maintain an adequate operating temperature not exceeding a maximum acceptable value. Several solutions have been envisaged for the cooling of electronic equipment: thermal convection cooling and thermal conduction cooling. Thermal convection consists of putting a hot body in contact with a fluid, preferably set in motion relative to the card so as to improve the heat exchange between the hot components and the cold fluid. Thermal conduction is a mode of heat transfer resulting from a temperature difference between two zones of the same medium or between two different media in contact. A known solution for cooling electronic boards 3036918 2 is to equip the printed circuit with a heat sink in the form of a plate made of a material with high thermal conductivity, such as copper or aluminum. The plate has substantially the same surface as the printed circuit and is parallel to it. This plate is fixed on the face of the printed circuit opposite to that receiving the electronic components. It allows the heat to be discharged from the printed circuit to a heat exchanger disposed within the cabinet and pressed against the heat sink, for example in the form of channels or plates in which circulates a cooling liquid. It is then necessary to connect these channels or plates to a cooling network external to the equipment. This solution is suitable for applications equipped with such a cooling network. On the other hand, this type of solution proves to be insufficiently effective for applications in which the cabinets are not equipped with a cooling network and which are generally equipped only with a fan. To correct this drawback, it is conventionally screwed a radiator comprising cooling fins on the face of the heat sink opposite the printed circuit. The radiator, by its fins, 20 increases the contact area between the electronic card and the fluid in contact with the electronic card, for example air. It improves convection cooling performance. A solution of this type is shown in FIG. 1 on which is visible the electronic card 100 comprising a printed circuit 101 comprising two faces 101a and 101b, a drain 102 fixed to the printed circuit 101 (and more precisely to the second face 101b of the printed circuit 101a), a component 1000 fixed to the printed circuit 101 (and more precisely brazed to the first face 101a), a radiator 104 comprising cooling fins 105 and a thin soleplate 106 relative to the heat sink. The radiator 104 is attached to the drain 102 and to the printed circuit 101 by means of a plurality of screw 107-nut 108 systems, typically at least ten, of which only one is visible in FIG. 1, the screw 107 passing through the drain 102 and the printed circuit 101, and a thermal grease layer 109 interposed between the radiator 104 and the drain 102 and ensuring a good heat exchange between the radiator 104 and the drain 102 by filling the interstices between these two elements. The applicant has found that this type of card has a number of disadvantages. The grease is composed of a mixture of two phases comprising a liquid phase (oil) which is a grease and a solid phase comprising conductive particles usually silver.
    [0002] These two phases separate in time and with increases in temperature which has the effect of reducing the energy dissipation performance of the radiator + drain system and may limit the performance of other cards or equipment inserted in the box, or even deteriorate their performances. Fixing the radiator 104 to the heat sink 102 by means of screw-nut systems 107-108 considerably limits the useful area of the printed circuit. It is indeed necessary to provide a sufficient isolation zone between each screw-nut system and the components on the face 101a of the printed circuit receiving the components. Furthermore, the operations of fixing the heat sink on the heat sink and applying the thermal grease are delicate operations to be performed manually, which are therefore expensive. In addition, the screw-nut systems disturb the air flow on the radiator side which has the effect of reducing the control of the cooling of the electronic plate. Finally, this type of solution has a significant thickness. The object of the invention is to correct all or part of the aforementioned drawbacks. To this end, the invention relates to an electronic card comprising an assembly of a printed circuit comprising a first face receiving at least one electronic component, and a heat sink, the printed circuit and the heat sink being stacked according to a stacking direction, said heat sink being attached to the printed circuit on a second face opposite to the first face, said heat sink comprising a plate-like sole, and reliefs protruding from a flat surface of said soleplate, the reliefs being intended to increase the contact surface between the heat sink and a flow of air relative to the contact surface between the soleplate and the airflow, the soleplate 35 being interposed between the printed circuit and the reliefs in the stacking direction 3036918 4. The heat sink is attached directly to the circuit board by bonding only and said heat sink is monobloc. Advantageously, the heat sink is fixed to the printed circuit by gluing by means of an adhesive film interposed between the soleplate circuit 5 printed in the stacking direction. The invention also relates to a method of manufacturing an electronic card comprising: a stacking step in which the heat sink is placed so that the soleplate is interposed between the reliefs and the second face of the printed circuit and in which has a layer of adhesive between the second face of the printed circuit and the sole, an assembly step of assembling the heat sink and the printed circuit in which the resulting stack is subjected to a hot compression. Advantageously, the assembly step is carried out by means of a press comprising a tool comprising a portion configured and arranged with respect to the heat sink so as to bear on the surface of which protrude the reliefs and extending between the landforms.
    [0003] Advantageously, the assembly step is performed by means of a press comprising a tool comprising a portion configured and arranged relative to the heat sink so as to bear on the entire surface of which protrude beyond the reliefs and extending between the reliefs.
    [0004] Advantageously, the assembly step is performed by means of a press comprising a tool comprising a portion configured and arranged relative to the heat sink so as to bear on the reliefs in the direction z. Advantageously, the printed circuit is multilayer and in which the assembly step is a step of assembling a plurality of layers of the printed circuit. Other features and advantages of the invention will become apparent on reading the detailed description which follows, given by way of non-limiting example and with reference to the appended drawings, in which: FIG. 1 already described schematically represents in cross-section an electronic card of the prior art, - Figure 2 shows schematically a box receiving an electronic card according to the invention on which the electronic components 5 and the radiator have not been shown for clarity, - Figure 3 represents schematically a section of an electronic card according to the invention, - Figure 4 shows a block diagram of the steps of the method according to the invention, - Figure 5 schematically shows a press used in the method according to the invention. From one figure to another, the same elements are identified by the same references.
    [0005] Figure 2 shows a box 90 comprising a plurality of slides 91 extending longitudinally parallel to each other. The box 90 receives an electronic card 1 according to the invention. The electronic card 1 is held in the frame 92 of the box 90 at the slides 91 perpendicular to the bottom of the basket.
    [0006] Figure 3 shows in perspective a section of an electronic plate according to the invention in a plane parallel to the stacking direction. The electronic plate 1 comprises an assembly of a printed circuit 2 and a heat sink 3. The printed circuit 2 is of the type comprising a plurality of individual layers not shown in FIG. 1. It comprises at least one conductive layer. copper and at least one insulating layer. It may be of the single-sided type (comprising a conductive layer and an insulating layer), double-sided (comprising two conductive layers separated by an insulating layer), or multilayer (comprising at least three conductive layers separated two by two by an insulating layer) . The individual conductive layers of the printed circuit are etched to form tracks. The printed circuit 2 comprises a first face 4 intended to receive one or more electronic components. Only one electronic component 5 is visible in FIG. 3. The first face 4 can receive several electronic components. All the electronic components fixed on the printed circuit 2 are received by the first face 4. In other words, each electronic component is fixed, preferably brazed, on the first face 4. The printed circuit 2 and the heat sink 3 are stacked in accordance with FIG. a stacking or stacking direction z. The individual layers, not shown, of the printed circuit 2 are also stacked in the stacking direction z. The heat sink 3 is fixed to the printed circuit on a second face 6 of the printed circuit 2. The second face 6 is opposite the first face 4. The first and second faces are parallel to each other 10 and perpendicular to the stacking direction z . The heat sink 3 extends substantially over the entire useful area of the printed circuit. In other words, the heat sink may extend over the entire surface of the printed circuit or, alternatively, extend over the usable area of the printed circuit extending between two rails holding the printed circuit in the cabinet without being closed. extend inside the two slides. The heat sink 3 comprises cooling fins 7 and a sole 8. The sole 8 is interposed between the cooling fins 7 and the printed circuit 2 according to the stacking direction z. The heat sink 3 has a comb-shaped profile in the plane 20 of the figure. The sole 8 provides a heat sink function for discharging the heat transmitted by the components to the printed circuit 2 from the second face 6 of the printed circuit 2 to the fins 7. The sole 8 has the shape of a plate. The plate extends along its thickness e, parallel to the stacking direction z. It is pressed against the printed circuit. The sole 8 is thick relative to the printed circuit 2. The printed circuit 2 typically has a thickness between 0.10 and 1 mm. The sole 8 has a thickness of at least 2 mm. Typically, the sole 8 has a thickness of between 2 and 5 mm. However, this range is not limitative insofar as the dimensions of the soleplate and the cooling fins are determined according to the thickness of the printed circuit, depending on the thickness of the desired electronic board and in function desired thermal performance. In a particular embodiment the heat sink 3 provides a stiffener function of the printed circuit 2. In this case, the sole 8 3036918 7 has a stiffness greater than that of the printed circuit. Alternatively, the printed circuit has a stiffness at least equal to the sole of the heat sink. The cooling fins 7 make it possible to improve the evacuation of the heat (dissipated by the printed circuit 2 due to the heating of the components) by convection with respect to a heat sink in the form of a plate by increasing the contact surface between the heat sink and the fluid in contact with the latter with respect to the contact surface between the sole 8 and the air flow, that is to say the free surface of the sole. In other words, a heat sink comprising the cooling fins, that is to say formed of the sole provided with the cooling fins, has with the air a contact surface greater than that of a heat sink comprising only the soleplate . Each fin 7 has the shape of a plate extending longitudinally in a direction parallel to a direction perpendicular to the plane of FIG. 3 and having, in the plane of FIG. 3, the shape of a rod extending longitudinally , according to the stacking direction z, from the sole 8 to a free end 10 according to. The fins 7 extend from a planar surface 8a of the sole opposite the printed circuit 2 in the stacking direction z. The flat surface 8a is discontinuous. It is formed by a plurality of portions separated by the fins. The fins 7 have a height H typically at least equal to 2 mm and typically between 2 and 15 mm. As for the sole, this interval is not limiting since the dimensions of the sole depend on several parameters as explained above. The plane of Figure 3 is a plane containing the stacking direction and perpendicular to the longitudinal direction of the fins. The height of the fins H fins is the direction of the fins in the stacking direction z. The fins 7 are separated in pairs by trenches 12. The trenches 12 extend longitudinally parallel to the longitudinal direction of the fins. The trenches have a U-shaped section in the plane of FIG. 3. The bottom of each U is formed by a portion of the surface 8a of the sole 8 opposite the printed circuit 2 and the arms of each U are formed by two fins 7 adjacent. The fin section is constant. In other words, they have constant dimensions along the direction in which they extend longitudinally (direction perpendicular to the plane of FIG. 3). Therefore, the trenches also have a constant section. According to the invention, the heat sink 3 is in one piece. In other words, the fins 7 and the sole 8 are formed in one piece. This piece is preferably but not necessarily full, as opposed to hollow. The heat sink may be made of a material having a high thermal conductivity. It is for example made of metal, preferably aluminum, or copper.
    [0007] According to the invention, the heat sink is fixed directly to the printed circuit 2 only by gluing. In other words, the heat sink 3 is fixed to the printed circuit by means of a film of adhesive 9 interposed between the heat sink and the printed circuit 2. More precisely, the adhesive film 9 is interposed between the sole 8 and the circuit 15. 2. By heatsink fixed directly to the printed circuit by bonding, it is meant that the printed circuit and the heatsink are separated only by a film of adhesive 9. The adhesive film 9 is an electrical insulator. The adhesive film has a minimum thickness of 100 microns and typically between 100 and 200 microns. It is thermosetting. The glue film extends over the entire surface of the sole 8 facing the printed circuit. These characteristics are related to the assembly process used and described in the rest of the text. The reduced thickness of the glue film allows a very efficient heat transfer between the printed circuit and the heat sink 3. The fact that the heat sink, providing the dual function of heat dissipation by thermal convection (fins) and conduction thermal (drain or sole), or monobloc and fixed only by gluing to the printed circuit brings a number of advantages. It can be fixed in a single step of non-manual gluing to the printed circuit, which limits the cost of assembling the electronic plate and makes it possible to offer an important implantation surface of the electronic components on the side of the first one. The heatsink 3 has a single interface with the printed circuit 2 (glue film 9), which implies that the heat transfer between these two elements is better than when the heatsink is of the following type. comprising a soleplate and a radiator interconnected by screws and separated by a thermal grease. This increase in thermal energy dissipation performance allows, for a given printed circuit board, given electronic components and given performance in terms of heat dissipation, to reduce the thickness of the heat sink. The thickness of the heat sink is given by the thickness of the sole 8 and the height H of the cooling fins 7. The invention typically makes it possible to produce electronic cards that can fit into the space allocated to a single electronic card in a rack or drawer according to the VME64 standard while obtaining the desired performance in terms of heat dissipation, especially for a power supply card which was not possible with the devices of the prior art. Typically, the heat sink has a thickness of between 5 and 20 mm in the stacking direction which allows for electronic boards having a thickness E less than or equal to 20.32 mm in the stacking direction corresponding to the thickness allocated to an electronic card in the VME standard. The electronic card according to the invention has a limited weight.
    [0008] Furthermore, the invention makes it possible to assemble the heat sink during a single assembly step which may be the assembly step of the printed circuit in the case of a multilayer printed circuit. In the latter case, the fixing of the heat sink on the printed circuit is not an additional step of subsequent assembly in the assembly step 25 of the printed circuit. The invention has been described with reference to an embodiment in which the heat sink comprises cooling fins. These fins are reliefs, that is to say structures protruding on a flat surface 8a of the sole 8. The reliefs are intended to increase the contact area between the heat sink 3 and a flow of air by relative to the contact surface between the sole 8 (free of relief) and the air flow. This embodiment is not limiting. An embodiment is envisaged in which the reliefs are in the form of pins, that is to say of studs or rods extending longitudinally in the stacking direction. The pins extend longitudinally in the stacking direction z from the sole 8 to a free end. Alternatively, the heat sink comprises at least one cooling fin and at least one pin. More generally, the invention relates to an electronic card in which the heat sink comprises a sole 8 as described above and reliefs on the surface of said sole, the reliefs being intended to increase the contact surface between the heat sink and an air flow with respect to the contact surface between the soleplate and the airflow. The reliefs protrude from a flat surface 8a of the sole in the stacking direction z. More specifically, these reliefs protrude from the flat surface 8a which is the surface of the sole opposite the printed circuit in the stacking direction z. The flat surface 8a extends between the reliefs. The flat surface 8a is discontinuous when the reliefs are fins and continues when the reliefs are pins. The reliefs are for example, but not limited to, pins or fins.
    [0009] All that has been said previously with the cooling fins is also valid with the pins and in general, with the reliefs on the surface of the sole.
    [0010] The invention also relates to a method of manufacturing an electronic card 1 according to the invention. FIG. 4 represents a block diagram of the steps of the method according to the invention. The method of manufacturing the electronic card according to the invention comprises: A stacking step 50 comprising a first step 50a consisting of placing the heat sink 3 so that the sole 8 is interposed between the reliefs which are, for example, fins 7 and the second face 6 of the printed circuit 30 2 and to have a layer of adhesive 9 between the second face 6 of the printed circuit and the sole 8, an assembly step 51 of the heat sink 3 and the printed circuit 2 in which the stack obtained during stacking step 50 is subjected to hot compression.
    [0011] During the stacking step 50, the heat sink 3 and the printed circuit 2 or the layers intended to form the printed circuit 2 and the heat sink are stacked in the stacking direction z so as to obtain a stack. 11. During the stacking step 51, the adhesive layer 9 is applied to the second face 6 of the printed circuit 2 and / or to the face of the sole 8 facing the second face 6 of the printed circuit 2 During the assembly step 51 the compression is carried out according to the stacking direction z. Hot compression means a step of compressing the stack during which the stack obtained is heated. The electronic components 5 are then reported on the printed circuit 2 and more precisely on the second face of the printed circuit. Advantageously, the tracks are etched prior to step 50. Advantageously, the printed circuit 2 is a multilayer printed circuit. The stacking step 50 comprises a second step 50b for stacking a plurality of layers intended to form the multilayer circuit in the stacking direction z. These layers are double-sided sets. The assembly step 51 of the heat sink 3 and the printed circuit 2 is then advantageously a step of assembling the printed circuit 2, that is to say a step of assembling the double-sided assemblies intended to form the multilayer printed circuit, that is to say a step of assembling a plurality of layers of the printed circuit. The assembly step 51 is performed by pressing the stack obtained during step 50 in the stacking direction. This is a so-called stratification step. Alternatively, the printed circuit is multilayer but the layers or part of the printed circuit layers are assembled before the assembly step 51. This is, for example, the case when layers must be interconnected between them. They are assembled prior to the step of assembling the heat sink with the printed circuit. FIG. 5 diagrammatically represents a press 40 making it possible to carry out the assembly step 51 of the method according to the invention. In this embodiment, the reliefs are fins. The press 40 comprises two tools 41, 42. The stack is made between these two tools 41, 42. Each tool 41, 42 is made of a plate 41a, 42a facing the stack 11 The press comprises a tool 43. The tooling is adjacent to the heat sink so as to bear on it during the pressing. The tool 43 comprises a portion 44 having a shape substantially complementary to the portion of the heat sink 3 opposite the printed circuit 2 in the direction z. In other words, the portion 44 of the tool 43 has a shape substantially complementary to the portion of the heat sink formed by the cooling fins 7 and the surface 8a of the sole 8 of which they exceed. During the assembly step 51, the heat sink 3 and the tool 43 cooperate so that the portion 44 substantially forms the cavity of the portion of the heat sink 3 opposite to the printed circuit, that is to say the portion of the heat sink 3 formed by the cooling fins 7 and the sole surface of which they exceed. In other words, the portion 44 of the tool 43 substantially matches the shape of the cooling fins 7 and the surface 8a of which they exceed. In other words, the tool 43 has a portion 44 intended to cooperate with the heat sink. This portion 44 has fins 44a of the tooling separated in pairs by trenches 44b of the tool 44b. The trenches of the tooling 44a and the fins of the tool 44b are configured and arranged relative to each other so that the portion 44 has a shape substantially complementary to that formed by the fins 7 and the trenches 12 of the heat sink 3. On the non-limiting embodiment of Figures 3 and 5, the fins 7 have the same dimensions in the plane of Figure 3 and are regularly spaced in a direction perpendicular to the stacking direction z in the plane of the figure 3, and separated by trenches 12 having all the same dimensions in the plane of Figure 3. The fins of the tool 44a therefore have a section substantially identical to that of the trenches 12 and the trenches of the tooling have substantially identical to those of the fins 7. In step 51, the tool 43 and the heat sink 3 are arranged relative to each other. the other so that the fins of the tool 44a 35 penetrate the trenches 12 and the fins 7 penetrate the trenches of the tool 44a. The tool then comes to bear on the entire surface 8a of which the fins 7 protrude and on the fins 7 during the pressing step. The tools 41, 42, 43 are, for example, steel or aluminum parts. The tool 43 is preferably made of a material having a coefficient of thermal expansion substantially identical to that of the heat sink 3 between the ambient temperature and the heating temperature. The tools 41, 42, 43 are then transferred into the compartments of the platen press 40. The trays 45, 46 are able to be brought together and spaced from each other by means of a device, not shown, for example of the type comprising cylinders. The tools 41, 42, 43 are placed in compression, in the direction of stacking z by bringing the two plates 45, 46 relative to each other in the stacking direction z. A heating circuit, not shown, warms the tools 41, 42, 43 or 41, 43 by means of a heating circuit at least partially incorporated in the plates 45, 46 so as to heat the stack 11 obtained. in step 50. Advantageously, a deformable mattress 47, 48 is interposed between the tooling 41 and the layers 20a, 20b intended to form the printed circuit 2 and between the tooling 42 and the tooling 43. Advantageously, the pressure applied to the stack 11 during the assembly step 51 is typically between 30 and 40 bar and the stack is heated to a temperature typically between 120 and 180 ° C. The temperature applied depends on the polymerization temperature of the glue used. The pressure and the temperature are applied for a duration typically between 1:30 and 3:30. This time depends on the polymerization cycle of the glue used. In the embodiment of Figure 5, a plurality of layers 20a, 20b for forming the printed circuit 2 are stacked in the z direction. These layers are typically double-sided. An adhesive layer 21 is interposed between these two layers, that is to say applied on at least one of the two facing layers. The shape of the tooling 43 makes it possible to achieve effective fastening 35 of the heat sink 3 on the printed circuit 2 without deformation of the cooling fins 7 and without shaping the assembly formed by the printed circuit 2 and the heat sink 3. It makes it possible to apply a substantially uniform pressure over the entire surface of the heat sink in a plane perpendicular to the stacking direction, which ensures a bonding of the heat sink to the printed circuit over the entire surface of the face of the heat sink located next to the printed circuit. It makes it possible to prevent the formation of air bubbles at the interface between the heat sink 3 and the printed circuit 2. This makes it possible to limit the risks of delamination of the electronic card and thus the reduction in its performance over time. under the effect of changes in temperature. More generally, the assembly step 51 is performed by means of a press comprising a tooling 42 comprising a portion 44 configured to have a shape substantially complementary to the portion of the heat sink 3 formed by the reliefs 7 and by the surface 8a, of the sole 8, from which they protrude. Moreover, during this step, the heat sink 3 and the tooling 42 are arranged so as to cooperate so that the portion 44 of the second tooling 42 substantially forms the cavity of the portion of the heat sink 3 formed by the reliefs 7 and by the surface 8a, of the sole 8, from which they exceed.
    [0012] By a portion 44 of the tool 43 substantially forms the cavity of the portion of the heat sink 3 formed by the reliefs 7 (or fins) and by the surface 8a of the sole 8 of which the reliefs protrude, it is understood that the portion 44 has a shape complementary to the reliefs 7 and the surface 8a to the operating clearance. The operating clearance is defined so as to avoid jamming between the tooling 43 and the heat sink 3 during the pressing, that is to say during step 51, and so that the tooling 43 comes resting on the entire surface of the reliefs and the surface 8a extending between the reliefs. In other words, during the assembly step 51, the heat sink and the tool 43 are deformed so as to fill the gaps between them. The tool is configured and disposed relative to the heat sink so as to bear on the entire surface 8a and the reliefs 7 in the z direction. In a variant, the portion 44 of the tool 43 forms, during the step 51, substantially the footprint of the at least one hollow portion 12 extending between the reliefs 7 and being delimited by the surface 8a. In other words, the portion 44 is configured and arranged relative to the heat sink 3 so as to have at least one substantially complementary relief of the at least one hollow portion extending between the reliefs 7. This complementarity is achieved in the game of operating close so as to avoid jamming between the tool 43 and the heat sink 3 during the pressing, that is to say during step 51 and so that the tool 43 comes to bear on the entire of the surface 8a extending between the reliefs. Consequently, the portion 44 is configured and arranged relative to the heat sink, during the step 51, so as to bear on the entire surface 8a of which protrude the reliefs 7. In a less advantageous variant, the shape of the portion 44 is defined so that it bears on a portion of the surface 8a. In the case of a pinned dissipator, the portion of the tooling has a relief extending continuously be the pins and in the case of a finned heat sink 3, the portion 44 comprises several reliefs (or fins ) 44a substantially complementary to the grooves 12.For example, the height h of the reliefs of the tool 43 is greater than that of the reliefs 7 of the heat sink and defined so that the clearance between the tooling and the reliefs is not caught up during the pressing step. This prevents the fins 7, the weakest part of the heat sink, from having to withstand the pressing force. This makes it possible to achieve a good uniformity of bonding on the surface of the heat sink between the reliefs 7. The method according to the invention makes it possible to obtain an electronic card in which the thermosetting glue film has a thickness that is typically between 100 and 200 micrometers. This ensures good heat transfer efficiency between the dissipator 3 and the printed circuit 2. In addition, the glue overflows around the heat sink in a plane perpendicular to the stacking direction z. This overflow is due to a creep of the glue during step 51.
    [0013] The tool 43 described can be used even when the printed circuit is not multilayered. The ranges given in the present patent application are the preferential intervals but they are not limiting, the measurements, times may be located outside these ranges. 35
    权利要求:
    Claims (7)
    [0001]
    CLAIMS1 Electronic card (1) comprising an assembly of a printed circuit (2) comprising a first face (4) receiving at least one electronic component, and a heat sink (3), the printed circuit (2) and the dissipator thermal device (3) being stacked in a stacking direction (z), said heat sink (3) being fixed to the printed circuit on a second face (6) opposite to the first face (4), said heat sink (3) comprising a sole (8), having the shape of a plate, and reliefs (7) protruding from a flat surface (8a) of said sole (8), the reliefs (7) being intended to increase the contact surface between the heat sink (3) and a flow of air with respect to the contact surface between the sole (8) and the air flow, the sole (8) being interposed between the printed circuit (2) and the reliefs ( 7) according to the stacking direction (z), characterized in that the heat sink (3) is fixed directly the printed circuit (2) by gluing only and in that said heat sink (3) is in one piece.
    [0002]
    2. The electronic card (1) according to claim 1, wherein the heat sink (3) is fixed to the printed circuit (2) by gluing by means of a glue film (9) interposed between the sole (8) the circuit printed according to the stacking direction.
    [0003]
    3. A method of manufacturing an electronic card according to any one of the preceding claims, characterized in that it comprises: - a stacking step (50) in which the heat sink (3) is placed so that the sole (8) is interposed between the reliefs (7) and the second face (6) of the printed circuit (2) and in which there is a layer of adhesive (9) between the second face (6) of the printed circuit and the sole (8), - An assembly step (51) of assembling the heat sink (3) and the printed circuit (2) in which the resulting stack is subjected to a hot compression. 3036918 17
    [0004]
    4. A method of manufacturing an electronic card according to the preceding claim, wherein the assembly step (51) is performed by means of a press comprising a tool (42) comprising a portion (44) configured and arranged by relative to the heat sink (3) so as to bear on the surface (8a) of which protrude the reliefs (7) and extending between the reliefs (7).
    [0005]
    5. A method of manufacturing an electronic card according to the preceding claim, wherein the assembly step (51) is performed by means of a press comprising a tool (42) comprising a portion (44) configured and arranged relative to the heat sink (3) so as to bear on the entire surface (8a) which protrude beyond the reliefs (7) and extending between the reliefs (7). 15
    [0006]
    6. A method of manufacturing an electronic card according to any one of claims 4 to 5, wherein the assembly step (51) is performed by means of a press comprising a tool (42) comprising a portion ( 44) configured and arranged with respect to the heat sink (3) so as to bear on the reliefs (7) in the direction z.
    [0007]
    7. A method of manufacturing an electronic card according to any one of claims 3 to 6, wherein the printed circuit board (2) is multilayer and wherein the assembly step is a step of assembling a plurality of layers of the printed circuit.
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    同族专利:
    公开号 | 公开日
    FR3036918B1|2018-08-10|
    EP3305048A1|2018-04-11|
    CN107690839A|2018-02-13|
    US20180132353A1|2018-05-10|
    WO2016193162A1|2016-12-08|
    EP3305048B1|2019-07-31|
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    法律状态:
    2016-04-26| PLFP| Fee payment|Year of fee payment: 2 |
    2016-12-02| PLSC| Publication of the preliminary search report|Effective date: 20161202 |
    2017-04-27| PLFP| Fee payment|Year of fee payment: 3 |
    2018-05-01| PLFP| Fee payment|Year of fee payment: 4 |
    2019-04-29| PLFP| Fee payment|Year of fee payment: 5 |
    2020-05-05| PLFP| Fee payment|Year of fee payment: 6 |
    2021-04-26| PLFP| Fee payment|Year of fee payment: 7 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1501114A|FR3036918B1|2015-05-29|2015-05-29|ELECTRONIC CARD AND METHOD OF MANUFACTURING THE SAME|
    FR1501114|2015-05-29|FR1501114A| FR3036918B1|2015-05-29|2015-05-29|ELECTRONIC CARD AND METHOD OF MANUFACTURING THE SAME|
    EP16727397.8A| EP3305048B1|2015-05-29|2016-05-27|Electronic board and associated manufacturing method|
    PCT/EP2016/062048| WO2016193162A1|2015-05-29|2016-05-27|Electronic board and associated manufacturing method|
    US15/574,133| US20180132353A1|2015-05-29|2016-05-27|Electronic board and associated manufacturing method|
    CN201680031347.XA| CN107690839A|2015-05-29|2016-05-27|Electron plate and relative manufacturing process|
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